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High-temperature deformation measurements using digital-image correlation
Authors:J. S. Lyons  J. Liu  M. A. Sutton
Affiliation:(1) Department of Mechanical Engineering, University of South Carolina, 29208 Columbia, SC
Abstract:The ability of the computer-vision technique of digital-image correlation to measure full-field in-plane surface deformations at elevated temperatures was evaluated by a series of experiments. Samples were subjected to pure translation, free thermal expansion and uniform tensile loads. Results are presented which show that the digital-image-correlation technique remains fully capable of accurate measurement of the displacements and strains on the surface of a planar object at temperatures up to 650°C.
Keywords:computer vision/digital-image processing  data reductions  nondestructive testing  test procedures  high temperature
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