Affiliation: | 1. Future Chips Constellation, Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;2. Veeco MOCVD Operations, Somerset, NJ 08873, USA;3. Department of Materials Science and Engineering, Pohang University of Science and Technology, Pohang 790-784, Republic of Korea;4. School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju 561-756, Republic of Korea |