| SMT生产中金手指污染的处理方法 |
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| 引用本文： | 刘福玉,李文玉.SMT生产中金手指污染的处理方法[J].电子工艺技术,2012(6):355-358. |
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| 作者姓名： | 刘福玉 李文玉 |
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| 作者单位： | 浪潮商用系统有限公司 |
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| 摘 要： | 防止金手指污染是生产过程中需要重点控制的工艺点,无论是从入厂检验还是后续的SMT实际生产过程中,都必须制定严格的工艺要求。结合实际生产中的一个金手指污染案例,分析产生问题的原因及采取的纠正预防措施,同时也汇总出在整个生产流程中容易出现问题的各种因素并提出相对应的解决方案。
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| 关 键 词： | PCB金手指 金手指污染 EDX分析 |
Gold Finger Pollution Treatment Method in SMT Production |
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| LIU Fu-yu,LI Wen-yu.Gold Finger Pollution Treatment Method in SMT Production[J].Electronics Process Technology,2012(6):355-358. |
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| Authors: | LIU Fu-yu LI Wen-yu |
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| Institution: | (Shandong InspurBusiness System Company Limited,Jinan 250101,China) |
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| Abstract: | preventing gold finger pollution is a key control point in SMT production.It should have strict technical requirements from incoming inspection to SMT actual production process.Analyze the reasons of the problems and take corrective and preventive measures combining with the actual production of a gold finger pollution case,and also summarize the various factors that will cause problems in the entire production and put forward the corresponding solution. |
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| Keywords: | PCB gold finger Gold finger pollution EDX analysis |
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