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Influence of the chemical nature of implanted ions on the structure of a silicon layer damaged by implantation
Authors:K. D. Shcherbachev  M. I. Voronova  V. T. Bublik  V. N. Mordkovich  D. M. Pazhin  V. I. Zinenko  Yu. A. Agafonov
Affiliation:1. National University of Science and Technology “MISIS”, Leninskii pr. 4, Moscow, 119049, Russia
2. Institute of Microelectronic Technology and Ultra-High-Purity Materials, Russian Academy of Sciences, ul. Akademika Osipiyana 6, Chernogolovka, Moscow oblast, 142432, Russia
Abstract:The influence of the implantation of silicon single crystals by fluorine, nitrogen, oxygen, and neon ions on the distribution of strain and the static Debye-Waller factor in the crystal lattice over the implanted-layer depth has been investigated by high-resolution X-ray diffraction. The density depth distribution in the surface layer of native oxide has been measured by X-ray reflectometry. Room-temperature implantation conditions have ensured the equality of the suggested ranges of ions of different masses and the energies transferred by them to the target. It is convincingly shown that the change in the structural parameters of the radiation-damaged silicon layer and the native oxide layer depend on the chemical activity of the implanted ions.
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