| 热塑性/热固性聚合物共混体系研究——乙炔端基砜/聚砜共混物的动态固化动力学 |
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| 引用本文： | 麦堪成,曾汉民.热塑性/热固性聚合物共混体系研究——乙炔端基砜/聚砜共混物的动态固化动力学[J].高分子学报,1991(1). |
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| 作者姓名： | 麦堪成 曾汉民 |
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| 作者单位： | 中山大学材料科学研究所，中山大学材料科学研究所 广州 510275，广州 510275 |
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| 摘 要： | 近年来,半互穿聚合物网络(SIPN)概念被用来研制能结合热塑性聚合物的加工性和热固性聚合物的高温性能的大分子体系,用于复合材料耐高温树脂基体。例如:乙炔端基酰亚胺低聚物与热塑性聚酰亚胺基SIPN,线性聚酰亚胺与热固性双马来酰亚胺基SIPN以及热塑性树脂与双腈基SIPN已有报道。研究结果表明共混物起到协同作用,易于加工并具有优异的性能。乙炔端基砜(ATS)树脂具有与聚砜树脂相类似的结构,被认为在将来代替环氧用于高性能粘合剂和复合材料树脂基体的候选者之一。其另
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| 关 键 词： | 乙炔端基砜 聚砜 共混物 固化动力学 |
STUDIES ON THERMOPLASTIC/THERMOSETTING POLYMER BLEND SYSTEMS--Dynamic Cure Kinetics of Acetylene-Terminated Sulfone and Polysulfone's Blends |
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| MAI Kancheng and ZENG Hanmin.STUDIES ON THERMOPLASTIC/THERMOSETTING POLYMER BLEND SYSTEMS--Dynamic Cure Kinetics of Acetylene-Terminated Sulfone and Polysulfone''''s Blends[J].Acta Polymerica Sinica,1991(1). |
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| Authors: | MAI Kancheng and ZENG Hanmin |
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| Abstract: | The dynamic cure kinetics of thermosetting acetylene-terminated sulfone (ATS) and two blends prepared by the ATS and thermoplastic bisphenol A polysulfone (PSF), polyary-lethersulfone with cardo group (PES-C) were determinated by differential scanning calori-metry (DSC). The addition of polysulfone's resin increases the temperature of initial reaction and decreases the activation energy of cure reaction(E), pre-exponnential factor (LnA), and heat of cure reaction (AH). The temperature of reaction peak and final reaction and the reaction order(n) have been no effect. |
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| Keywords: | Acetylene-terminated sulfone Polysulfone Blends Cure kinetics |
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