Study of curing behaviour and thermal properties of elastomer-modified bismaleimide resin |
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Authors: | S Katiyar A K Nagpal |
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Institution: | (1) Department of Plastic Technology, Harcourt Butler Technological Institute, 208 002 Kanpur, India |
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Abstract: | Bismaleimide resin (Compimide 353) was modified with the liquid elastomer carboxyl-terminated acrylonitrile butadiene (CTBN). The prereaction synthesis and curing of the CTBN-bismaleimide resin is discussed. The structure of the modified resin was identified by IR and NMR spectroscopy. The basic curing mechanism is also discussed. DSC and TG were used to study the curing behaviour and kinetic parameters, viz. the order of reaction, energy of activation and preexponential factor. Adhesive properties such as lap shear strength and peel strength at room temperature and elevated temperature were evaluated and are discussed. |
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Keywords: | bismaleimide resin CTBN curing behaviour DSC TG |
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