| INVESTIGATION OF BEHAVIOR OF MODE-Ⅰ INTERFACE CRACK IN PIEZOELECTRIC MATERIALS BY USING SCHMIDT METHOD |
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| 引用本文： | 周振功,王彪.INVESTIGATION OF BEHAVIOR OF MODE-Ⅰ INTERFACE CRACK IN PIEZOELECTRIC MATERIALS BY USING SCHMIDT METHOD[J].应用数学和力学(英文版),2006,27(7):871-882. |
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| 作者姓名： | 周振功 王彪 |
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| 作者单位： | [1]Center for composite materials, Harbin Institute of Technology, Harbin 150001, P. R. China [2]School of Physics and Engineering, Sun Yat-Sen University, Guangzhou 510275, P. R. China |
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| 基金项目： | Project supported by the National Natural Science Foundation of China （Nos.10572155, 10572043）; the Natural Science Foundation for Distinguished Young Scholars of Heilongjiang Province of China （No.JC04-08） |
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| 摘 要： | The behavior of a Mode-Ⅰ interface crack in piezoelectric materials was investigated under the assumptions that the effect of the crack surface overlapping very near the crack tips was negligible. By use of the Fourier transform, the problem can be solved with the help of two pairs of dual integral equations. To solve the dual integral equations, the jumps of the displacements across the crack surfaces were expanded in a series of Jacobi polynomials. It is found that the stress and the electric displacement singularities of the present interface crack solution are the same as ones of the ordinary crack in homogenous materials. The solution of the present paper can be returned to the exact solution when the upper half plane material is the same as the lower half plane material.
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| 关 键 词： | 界面裂缝 强度因子 压电材料 强度力学 |
| 收稿时间： | 2005-01-06 |
| 修稿时间： | 2006-03-21 |
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