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Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors |
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| Authors: | Jussi Putaala Jari Hannu Esa Kunnari Matti Mäntysalo Olli Nousiainen Heli Jantunen |
| Institution: | 1. Microelectronics and Materials Physics Laboratories, University of Oulu, P.O. Box 4500, FI 90014 Oulu, Finland;2. Tampere University of Applied Sciences, Kuntokatu 3, FI 33520 Tampere, Finland;3. Department of Electronics and Communication Engineering, Tampere University of Technology, P.O. Box 692, FI 33101 Tampere, Finland;4. Materials Engineering Laboratory, University of Oulu, P.O. Box 4200, FI 90014 Oulu, Finland |
| Abstract: | This work dealt with potential reliability issues in inkjet-printed electronics. The aim was to increase our understanding of how failures occur in hybrid electronic structures that utilize inkjet printing. A future goal in this field will be to enable expansion of this product area from low-life-expectancy and -performance products to high-life-expectancy and -performance products. |
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