| MCM封装技术中的基板设计与分析 |
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| 引用本文： | 丁俊民,吴晓纯,孙玲. MCM封装技术中的基板设计与分析[J]. 电子与封装, 2006, 6(9): 11-14 |
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| 作者姓名： | 丁俊民 吴晓纯 孙玲 |
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| 作者单位： | 南通大学江苏省专用集成电路设计重点实验室,江苏,南通,226007;南通富士通微电子有限公司,江苏,南通,226001 |
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| 摘 要： | 通过采用多芯片组件封装技术,将6种由不同集成电路工艺实现的不同类型的芯片集成在单个封装内,简化了系统设计,实现了产品小型化的目标。同时,还详细给出了Zeni EDA工具下的MCM基板设计流程以及MentorPCB环境下的多芯片组件热分析方法。
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| 关 键 词： | 多芯片组件 基板设计 热分析 |
| 文章编号： | 1681-1070（2006）09-0011-04 |
| 收稿时间： | 2006-02-23 |
| 修稿时间： | 2006-02-23 |
Design of Silicon Substrate for MCM Packaging |
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| DING Jun-min,WU Xiao-chun,SUN Ling. Design of Silicon Substrate for MCM Packaging[J]. Electronics & Packaging, 2006, 6(9): 11-14 |
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| Authors: | DING Jun-min WU Xiao-chun SUN Ling |
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| Affiliation: | 1. Nantong University, Jiangsu Provincial Key Lab of ASIC Design, Nantong 226007, China ; 2. Nantong Fujutsu Microelectronics Co., Ltd. Nantong 226001, China |
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| Abstract: | Based on MCM technology,an approach which implemented six discrete chips arranged in a single- package was presented in this paper.It was helpful to improve the integration of electronic system.After the introduc- tion of silicon substrate design flow in Zeni EDA layout tool,thermal distribution in MCM packaging was analyzed by using the Autotherm tool of Mentor Graphics' PCB Boardstation products.The practical application implies that multiple bare dice implemented in different technology can be packaged into a standard IC package and works well. |
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| Keywords: | multi-chip module design of silicon substrate thermal analysis |
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