Poly­sulfonyl­amines. CLXXI. [Di­(methane­sulfonyl)­amido‐κN]­bis(2‐picoline‐κN)copper(I)

The title compound, [Cu(C₂H₆NO₄S₂)(C₆H₇N)₂], consists of monomeric mol­ecules in which the Cu atom displays planar but irregular coordination by three N‐atom donors; Cu—N = 2.1054 (12) (amide N), 1.9514 (12) and 1.9589 (12) Å, and N—Cu—N = 141.24 (5), 111.54 (5) and 107.20 (5)°. Intramolecular Cu⋯O contacts are observed. The packing involves (interconnected) layer formation via C—H⋯O interactions in two directions, three hydrogen bonds combining to form layers parallel to (101) and five to form layers parallel to (10).