| 0.5mm间距CSP/BGA器件无铅焊接工艺技术研究 |
| |
| 引用本文： | 孙国清,李承虎.0.5mm间距CSP/BGA器件无铅焊接工艺技术研究[J].电子工业专用设备,2011,40(5):25-27,51. |
| |
| 作者姓名： | 孙国清 李承虎 |
| |
| 作者单位： | 中国电子科技集团公司第三十八研究所,安徽合肥,230031 |
| |
| 摘 要： | 芯片级封装器件因其小尺寸、低阻抗、低噪声等优点广泛应用于电子信息系统中.从器件封装、印制板焊盘设计、焊膏印刷、贴装以及回流焊接等方面探讨了0.5 mm间距CSP/BGA器件无铅焊接工艺技术.
|
| 关 键 词： | 芯片级封装 无铅 印刷 贴装 回流焊接 |
Research of Lead-free Soldering about 0.5 mm Pitch CSP/BGA Components |
| |
| SUN Guoqing,LI Chenghu.Research of Lead-free Soldering about 0.5 mm Pitch CSP/BGA Components[J].Equipment for Electronic Products Marufacturing,2011,40(5):25-27,51. |
| |
| Authors: | SUN Guoqing LI Chenghu |
| |
| Institution: | SUN Guoqing,LI Chenghu (The 38th Research Institute of CETC,Hefei 230031,China) |
| |
| Abstract: | CSP components are widely applied to the electron information systems for their little size、low impedence and low yawp and so on.The paper discusses the technology of lead-free soldering about 0.5mm pitch CSP/BGA components from components incapsulation、designing of bonding pads、solder paste printing、picking And placing and reflow soldering. |
| |
| Keywords: | CSP(chip scale packaging) Lead-free Printing Pick And Place Reflow Soldering |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
