| 热感应型形状记忆高分子材料 |
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| 引用本文： | 郑一泉,任少平,凌有道,吕满庚.热感应型形状记忆高分子材料[J].高分子通报,2006(4):70-75,92. |
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| 作者姓名： | 郑一泉 任少平 凌有道 吕满庚 |
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| 作者单位： | 1. 广东省电子有机聚合物重点实验室,广州,510650;中国科学院广州化学研究所,广州,510650;中国科学院研究生院,北京,100039
2. 广东省电子有机聚合物重点实验室,广州,510650;中国科学院广州化学研究所,广州,510650 |
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| 摘 要： | 热感性型形状记忆高分子材料（thermostimulative shape memory polymer，TSMP）不仅具有形变量大、赋形容易，形状回复温度便于调节、加工方便等特点，而且种类丰富。按其固定相结构的不同，可分为热塑性TSMP和热固性TSMP。本文从表征方法、记忆机理等方面简述了热感应型形状记忆高分子材料最新的发展，其中重点阐述了近期热感应型形状记忆可降解高分子的形状记忆原理及其应用。
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| 关 键 词： | 功能高分子材料 热感应 形状记忆材料 |
Thermostimulative Shape Memory Polymer |
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| ZHENG Yi-quan,REN Shao-ping,LING You-dao,L Man-geng.Thermostimulative Shape Memory Polymer[J].Polymer Bulletin,2006(4):70-75,92. |
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| Authors: | ZHENG Yi-quan REN Shao-ping LING You-dao L Man-geng |
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| Institution: | 1 Key Laboratory of Polymer Materials for Electronics, Guangdong 510650, China; 2 Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou 510650, China; 3 Graduate School of the Chinese Academy of Sciences, Beijing 100039, China |
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| Abstract: | Thermostimulative Shape Memory Polymer Materials have the advantages of large deformation, light mass, rich variety, good processability, convenient to deform and easy regulate shape memory temperature. This article reviews the progress of TSMP based on the characterization and mechanics of shape memory and highlights mechanism and application of the biodegradable shape memory polymer. |
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| Keywords: | Functional materials Thermostimulative Shape memory polymer |
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