Coalescence process of monodispersed Co cluster assemblies |
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Authors: | DL Peng TJ Konno K Wakoh T Hihara K Sumiyama |
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Institution: | (1) CREST of Japan Science and Technology Corporation, Kawaguchi 332-0012, Japan, JP;(2) Institute for Materials Research, Tohoku University, Sendai 980-8577, Japan, JP;(3) Department of Materials Science and Engineering, Nagoya Institute of Technology, Nagoya 466-8555, Japan, JP |
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Abstract: | Cluster-cluster coalescence process of monodispersed Co clusters with mean diameter d = 8.5 and 13 nm deposited a plasma-gas-condensation-type cluster beam deposition system was investigated by in situ electrical conductivity measurements and ex situ scanning electron microscopy (SEM) and transmission electron microscopy (TEM), and analyzed by percolation concept. The electrical
conductivity measurement and TEM observation indicated that, below temperature T≈ 100°C, the Co clusters in the assemblies maintain their original structure as deposited at room temperature, while that the inter-cluster
coalescence takes place at T > 100°C, although the size distribution and the interface morphology of the clusters showed no marked change at substrate temperatures
T
s≤200°C.
Received 29 November 2000 |
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Keywords: | PACS 61 46 +w Nanoscale materials: clusters nanoparticles nanotubes and nanocrystals – 73 40 -c Electronic transport in interface structures – 61 16 Bg Transmission reflection and scanning electron microscopy |
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