聚酰亚胺薄膜表面粗糙度的影响因素

 采用热蒸发气相沉积聚合方法（VDP）制备了聚酰亚胺(PI)薄膜，研究了设备、衬底温度、升温过程和单体配比因素对PI薄膜表面形貌的影响。利用干涉显微镜和扫描电镜对薄膜表面形貌进行了分析；利用原子力显微镜测定了薄膜表面粗糙度。结果表明：设定蒸发源-衬底距离为74 cm时可成连续膜；蒸发源采用一段升温和多段升温时，膜表面均方根粗糙度分别为291.23 nm和61.99 nm；采用细筛网可防止原料的喷溅；均苯四甲酸二酐和4，4′-二氨基二苯醚（PMDA和ODA）单体沉积速率比值为0.9∶1时，膜表面均方根粗糙度值可减小至3.30 nm；沉积衬底温度保持30 ℃左右时，膜表面均方根粗糙度为4.01 nm, 随温度的上升，膜表面质量会逐渐变差。

Factors influencing surface roughness of polyimide film

The polyimide (PI) films of pyromellitic dianhydride-oxydiamiline (PMDA-ODA) were fabricated using vapor deposition polymerization (VDP) method under high vacuum pressure of 10^-4 Pa level. The influence of equipment, substrate temperature, the process of heating and deposition ratio of monomers on the surface roughness of the PI films was investigated. The surface topography of films was measured by interferometer microscopy and scanning electron microscopy (SEM), and the surface roughness was probed with atomic force microscopy（AFM）. The results show that consecutive films can be formed when the distance from steering flow pipe to substrate is 74 cm. The surface roughnesses are 291.2 nm and 61.9 nm respectively for one-step heating process and multi-step heating process, and