微带板与金属载体间的大面积焊接及胶接方法

工程中常常需要把微带板和金属载体焊接或胶接起来,以获得合适的刚性、电导率和热导率,从而使丝网印刷、元器件贴装等工艺过程变得更加容易.并防止焊接过程中微带板的翘曲和变形。采用这种方法.可以在微带板和金属载体间得到连续的接地,微带板和一些高功率元件(如功率管)产生的热量也能迅速散发。

The Ways of Bonding a Micro-Strip Board to a Metal Carrier

In electronic engineering, we usually have to bond a micro-strip board to a metalcarrier in order to provide proper stiffness, thermal conductivity and electrical conductivity, thus to make general handling,solder stencilling, pick and place of components be easier, and prevent the warping or distortion of the board during soldering. In this way,a continuous grounding between the micro-strip board and the carrier can be obtained,and most of the heat of the board and high power components,such as power transistors,can be dissipated rapidly.