Rapid,On‐Command Debonding of Stimuli‐Responsive Cross‐Linked Adhesives by Continuous,Sequential Quinone Methide Elimination Reactions |
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Authors: | Hyungwoo Kim Hemakesh Mohapatra Scott T Phillips |
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Abstract: | Adhesives that selectively debond from a surface by stimuli‐induced head‐to‐tail continuous depolymerization of poly(benzyl ether) macro‐cross‐linkers within a poly(norbornene) matrix are described. Continuous head‐to‐tail depolymerization provides faster rates of response than can be achieved using a small‐molecule cross‐linker, as well as responses to lower stimulus concentrations. Shear‐stress values for glass held together by the adhesive reach 0.51±0.10 MPa, whereas signal‐induced depolymerization via quinone methide intermediates reduces the shear stress values to 0.05±0.02 MPa. Changing the length of the macro‐cross‐linkers alters the time required for debonding, and thus enables the programmed sequential release of specific layers in a glass composite material. |
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Keywords: | adhesives depolymerization materials science polymers stimuli‐responsive materials |
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