一种新型Ku频段瓦式T/R组件的研制

介绍了一种基于非接触式垂直互连、大功率高密度集成芯片组和低成本高密度混合电路的Ku频段半双工瓦式高发射功率T／R组件的集成方案。研制了16通道T/R组件原理样机，体积为36 mm×36 mm×21 mm，质量为65 g。每个信道的发射功率大于7 W，幅度一致性均方根误差（RMS）优于0.5 dB，相位一致性RMS优于4°。对比相似功能单通道发射功率仅0.5 W的砖式TR组件，其体积缩减一半以上，质量缩减2/3以上。

Development of a novel Ku-band tile-type T/R module

This paper presents an integrated solution of a Ku-band half-duplex and tile-type high transmitted power T/R module.The sixteen channels T/R prototype is developed by using non-contact vertical interconnections,high-power&high-density integrated chip sets,low-cost and high-density hybrid PCB.The size of the module is 36 mm×36 mm×21 mm and weight 65 g,the transmitted power of each channel is nearly 8 W,the amplitude consistency root mean square error(RMS) is better than 0.5 dB and phase consistency RMS is better than 4°.The size is reduced more than 50%,and the weight is reduced more than 2/3,compared with the similar function brick-type T/R module.