Silica-containing polyetherimide hybrid films based on methyltriethoxysilane as precursor of inorganic network |
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| Institution: | 1. “Petru Poni” Institute of Macromolecular Chemistry, Aleea Gr. Ghica Voda 41A, 700487, Iasi, Romania;2. Centre of Polymer and Carbon Materials, Polish Academy of Sciences, M. Curie-Sklodowskiej 34, 41-819, Zabrze, Poland;1. Argonne National Laboratory, Argonne, IL 60439, USA;2. Los Alamos National Laboratory, Los Alamos, NM 87545, USA;1. Instituto de Desarrollo Tecnológico para la Industria Química (INTEC, UNL-CONICET), Güemes 3450, 3000 Santa Fe, Argentina;2. Facultad Regional Santa Fe, Universidad Tecnológica Nacional, Lavaise 610, 3000 Santa Fe, Argentina;3. Polymer Institute, Slovak Academy of Science, Dúbravská cesta 9, 84541 Bratislava, Slovakia;1. Gansu Provincial Key Laboratory of Aridland Crop Science, College of Life Science and Technology, Gansu Agricultural University, Lanzhou 730070, China;2. Institute of Crop, Gansu Academy of Agricultural Sciences, Lanzhou 730070, China;1. Dipartimento di Chimica Industriale “Toso Montanari”, Università di Bologna, Viale Risorgimento 4, 40136 Bologna, Italy;2. Interdepartmental Center for Industrial Research on Advanced Applications in Mechanical Engineering and Materials Technology, CIRI MAM, Italy |
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| Abstract: | Polyetherimide hybrid films containing 5–40% silica were prepared through a sol-gel process and thermal imidization by using methyltriethoxysilane as precursor of the inorganic network and a poly(amic acid) resulting from polycondensation reaction of 2,2-bis4-(4-aminophenoxy)phenyl]propane with 2,2-bis(3,4-dicarboxyphenoxy)phenyl]propane dianhydride. The properties of these films, morphology, water vapor sorption capacity, free surface energy, mechanical, thermal and electrical characteristics, were studied. The films exhibited good thermal stability, having an initial decomposition temperature above 470 °C and glass transition temperature in the range of 187–200 °C. They showed low dielectric constant and low dielectric loss in a large frequency field. Gas permeation tests using small molecules (He, N2, O2 and CO2) at 6 bar and 30 °C indicated that the hybrid films containing higher silica content showed higher permeability for all the tested gases. |
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| Keywords: | Polyetherimide Thin films Thermal properties Low dielectric constant Conductivity Gas permeation |
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