| 高层板对位精度计算模型研究 |
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| 引用本文： | 李艳国,袁凯华,李志东.高层板对位精度计算模型研究[J].印制电路信息,2011(4):47-49. |
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| 作者姓名： | 李艳国 袁凯华 李志东 |
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| 作者单位： | 广州兴森快捷电路科技有限公司,广东,广州,510663 |
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| 摘 要： | 测量影响高层板对位精度的因素的精度及其标准偏差,并采用瑞利分布函数预测不同对位精度对应的成品合格率,在此基础上,确定了需要优先改进的工序及其标准偏差控制要求,为从定量的角度优化关键因素提供了有效的方法。
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| 关 键 词： | 高层板 对准度 标准偏差 瑞利分布 |
Studies on calculating model of multilayer PCB registration capability |
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| LI Yan-guo,YUAN Kai-hua,LI Zhi-dong.Studies on calculating model of multilayer PCB registration capability[J].Printed Circuit Information,2011(4):47-49. |
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| Authors: | LI Yan-guo YUAN Kai-hua LI Zhi-dong |
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| Institution: | LI Yan-guo YUAN Kai-hua LI Zhi-dong |
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| Abstract: | precision and standard deviation of factors which have a major impact on registration capability of multilayer PCB is measured;In the paper,rayleigh distribution function was utilized to predict the rate of standard end products,based on this,priority of improving process and control requirement of standard deviation were determined.This model provides an effective means of optimizing the key factor from a quantitative angle. |
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| Keywords: | multilayer PCB registration capability standard deviation Rayleigh distribution |
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