| 高层盲埋孔厚铜板制作探讨 |
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| 引用本文： | 陆玉婷,王俊,卫雄,龙小明,游俊. 高层盲埋孔厚铜板制作探讨[J]. 印制电路信息, 2011, 0(4): 142-145 |
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| 作者姓名： | 陆玉婷 王俊 卫雄 龙小明 游俊 |
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| 作者单位： | 景旺电子(深圳)有限公司,广东,深圳,518102 |
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| 摘 要： | 随着电子科技的不断发展,高层厚铜线路板应运而生。文章从高层厚铜板的制作设计、工艺流程、制作要点等进行经验总结,为生产设计提供数据支持。
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| 关 键 词： | 高层厚铜 盲埋孔 电流承载力 介质层厚度 工艺流程 控制要点 |
Discussion on production of high-level thick copper blind and buried vias board |
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| LU Yu-ting,WANG Jun,WEI Xiong,LONG Xiao-ming,YOU Jun. Discussion on production of high-level thick copper blind and buried vias board[J]. Printed Circuit Information, 2011, 0(4): 142-145 |
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| Authors: | LU Yu-ting WANG Jun WEI Xiong LONG Xiao-ming YOU Jun |
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| Affiliation: | LU Yu-ting WANG Jun WEI Xiong LONG Xiao-ming YOU Jun |
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| Abstract: | Along with the unceasing development of electronic technology,the high multi-layer thick copper PCB arises at the historial moment.It will be empirically summarized in this article from the high multi-layer thick copper PCB's manufacture design,the technical process,the manufacture main points and so on to provide the data support for the production and design. |
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| Keywords: | high-level thick copper buried and blind vias current carrying capacity media thickness production flow control points |
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