| 临时阻焊膜在高频电路板表面组装中的应用 |
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| 引用本文： | 林伟成.临时阻焊膜在高频电路板表面组装中的应用[J].电子工艺技术,2004,25(5):213-215,221. |
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| 作者姓名： | 林伟成 |
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| 作者单位： | 中国电子科技集团公司第38研究所,安徽,合肥,230031 |
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| 摘 要： | 高频电路板不能涂覆永久性阻焊膜,因为阻焊膜作为一种电介质将严重影响电路板的高频性能.但是,没有阻焊膜会给高频电路板上表面组装元件的焊接带来一系列的问题,出现诸如:焊点焊料缺乏、元件歪斜、元件脱离焊盘、元件立碑等现象,给电路板带来严重的外观和可靠性的问题.现在,我们可以用临时阻焊膜来解决这一问题.
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| 关 键 词： | 临时阻焊膜 高频电路板 表面贴装技术 |
| 文章编号： | 1001-3474(2004)05-0213-03 |
Application of temporary solder mask in SMT of high frequency circuit boards |
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| LIN Wei-cheng.Application of temporary solder mask in SMT of high frequency circuit boards[J].Electronics Process Technology,2004,25(5):213-215,221. |
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| Authors: | LIN Wei-cheng |
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| Abstract: | High frequency PCB(printed circuit board) can't be coated with solder mask,because solder mask on PCB,as a kind of dielectric,will greatly affect the electronic characteristics of high frequency circuits.But,the soldering of SMD(surface mounted devices) on PCB with no solder mask will bring on a lot of problems during assembly,such as:lack of solder in solder joints,components soldered on PCB are skew,are away from solder pads,stand up like tombstones.Now we can use temporary solder mask to solve all the problems. |
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| Keywords: | Temporary solder mask High frenquency circuit boards SMT |
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