| WLP用喷镀装置中的匀流板优化设计 |
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| 引用本文： | 王水弟,胡涛,蔡坚,贾松良.WLP用喷镀装置中的匀流板优化设计[J].电子工业专用设备,2003,32(4):49-52,67. |
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| 作者姓名： | 王水弟 胡涛 蔡坚 贾松良 |
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| 作者单位： | 清华大学微电子学研究所,北京,100084 |
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| 摘 要： | 喷镀式电镀已广泛应用于圆片级封装(WLP)中,电镀杯是喷镀装置中最关键的部件,杯中的匀流板又是影响电镀质量关键。对匀流板的形状和位置进行了计算机模拟和优化,并实际应用于喷镀装置中,取得了很好结果。
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| 关 键 词： | 喷镀 匀流板 封装 |
| 文章编号： | 1004-4507(2003)04-0049-04 |
The Diffuser's Optimum Design in Fountain-Plating for Wafer Level Package |
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| WANG Shui-di,HU Tao,CAI Jian,JIA Song-liang.The Diffuser''''s Optimum Design in Fountain-Plating for Wafer Level Package[J].Equipment for Electronic Products Marufacturing,2003,32(4):49-52,67. |
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| Authors: | WANG Shui-di HU Tao CAI Jian JIA Song-liang |
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| Abstract: | The fountain-plating is widely used for plating in wafer level package(WLP).Plating cup is the key com ponent in the plating apparatus and the diffuser is the most important part in cup,which will greatly affect the quality.The simulation and optimization of solution flow in the cup by computational fluid dynamics(CFD)tool have been intro duced in this paper.The results have been successfully used for the machine design. |
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| Keywords: | Fountain-Plating Diffuser Package |
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