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p-Si上电沉积Ni-W合金薄膜
引用本文:郭永,张国庆,姚素薇,郭鹤桐,龚正烈. p-Si上电沉积Ni-W合金薄膜[J]. 应用化学, 1996, 0(2)
作者姓名:郭永  张国庆  姚素薇  郭鹤桐  龚正烈
作者单位:天津大学应用化学系,天津理工学院,山西雁北师范学院
摘    要:利用恒电流沉积法,在p-Si上制备出不同W含量和不同结构的Ni-W薄膜,研究了镀液温度,pH值,电流密度对镀层组成的影响,结果表明,提高温度有利于获得高W含量的合金.随着镀层中W含量的增加,Ni面心立方晶格f.c.c发生正畸变,晶粒平均尺寸变小,当W含量达到56%以上时,晶粒小于2nm,薄膜呈非晶态结构.

关 键 词:p-Si,Ni-W合金,电沉积,非晶

The Electrodeposition of Nickel-Tungsten Films on p-type silicon
Guo Yong, Zhang Guoqing, Yao Suwei, Guo Hetong. The Electrodeposition of Nickel-Tungsten Films on p-type silicon[J]. Chinese Journal of Applied Chemistry, 1996, 0(2)
Authors:Guo Yong   Zhang Guoqing   Yao Suwei   Guo Hetong
Abstract:Nickel-tungsten films with different content of W and different structure were prepared by means of galvanostatic electrodeposition. The influence of temperature, pH value and current density on the composition of deposits was investigated. Experimental results showed that a rise in temperature is favorable to the increase of W content. X-ray diffraction was used to determine the film structure. With increase of W content. the f. c. c lattice of nickel is distorted, and the average size of grains becomes smaller. When the content of W in deposits reaches to about 56/00, the size of grains decreases to below 2 nm and the film has an amorphous structure.
Keywords:p-type silicon   nickel-tungsten alloy   electrodeposition   amorphous state
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