Preparation and Characterization of Silicon-containing Polyarylacetylene/montmorilloite Nanocomposites

Dimethylphenylpropargyl ammonium bromide (DMPPAB) was synthesized and used to modify pristine montmorillonite (MMT) by a cation exchange process. The organically modified montmorillonite (OMMT) was verified and used to mix with a silicon-containing polyarylacetylene (PSA) as well as MMT. The PSA/MMT and PSA/OMMT nanocomposites were prepared by solution under sonication and melting intercalation processes, respectively, and then cured by a step heating process. The thermal and flexural properties of the cured PSA and nanocomposites were studied by thermogravimetric and dynamic mechanical analysis. The results showed that the intercalation of DMPPAB into the MMT galleries made the d-spacing enlarge. During PSA curing, the cure heat of PSA caused the MMT and OMMT to delaminate and exfoliate in the PSA matrix. The glass transition temperature of the cured PSA and nanocomposites were higher than 500?°C. The inner acetylenic groups in the PSA resin could further crosslink above 300?°C. The temperature at 5% mass loss of the cured PSA decreased by 4.6% with 3% mass fraction of OMMT loading, and the char yield of the cured PSA changed only slightly. The flexural strength of the cured PSA was augmented with addition of MMT or OMMT, but the flexural modulus of the cured PSA decreased slightly. The flexural strength of the cured nanocomposite increased from 20.1?MPa to 30.1?MPa when 3% mass fraction of OMMT was added into the PSA matrix.