Investigation of a dual-layer structure using vertical scanning interferometry

This paper proposes a method based on white light vertical scanning interferometry (VSI) to investigate a dual-layer structure. The optical arrangement is based on a modified Michelson interferometer that utilizes a reference beam and two object beams. Each object beam interferes with the reference beam and produces an interferogram. A series of interferograms are obtained on a dual-layer structure and the thickness of each layer is obtained. A continuous wavelet transform (CWT) is used to extract the envelope of each interferogram in order to determine the peak intensity that provides an indication of each layer's boundary. Tests are conducted on a semiconductor wafer and a micro-gear made of polymeric material deposited on a metal substrate. Results show that the proposed method has a good potential for investigating a dual-layer micro-structure.