| 混合集成电路常见装配结构热阻分析 |
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| 引用本文： | 刘中其,唐喆.混合集成电路常见装配结构热阻分析[J].微电子学,2006,36(6):697-701,706. |
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| 作者姓名： | 刘中其 唐喆 |
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| 作者单位： | 中国电子科技集团公司,第二十四研究所,重庆,400060 |
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| 摘 要： | 从常规电子产品热设计基础理论的理解分析入手,结合实际应用,阐述了混合集成电路典型装配结构热阻的简便分析方法;绘制了多种典型结构的内热阻与发热芯片面积的关系曲线和外热阻与封装表面积的关系曲线;提出了通过典型结构热阻曲线分析产品芯片结温的方法,及相应问题的处理办法;对一般混合集成电路的非精确热设计有一定的参考意义。
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| 关 键 词： | 混合集成电路 装配结构 热设计 热阻 |
| 文章编号： | 1004-3365（2006）06-0697-05 |
| 收稿时间： | 2006-06-01 |
| 修稿时间： | 2006-06-012006-08-20 |
An Analysis on Thermal Resistance of Assembly Structures for Hybrid IC's |
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| LIU Zhong-qi,TANG Zhe.An Analysis on Thermal Resistance of Assembly Structures for Hybrid IC''''s[J].Microelectronics,2006,36(6):697-701,706. |
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| Authors: | LIU Zhong-qi TANG Zhe |
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| Institution: | Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corporation, Chonging 400060, P. R. China |
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| Abstract: | Based on the basic theory of thermal design for conventional electronic products,and combined with practical applications,a simple method for analyzing thermal resistance of typical assembly structures for hybrid(IC's) is described.Curves of internal thermal resistance of different typical structures vs.heating chip areas and external resistance vs.package surface areas are plotted.A method to analyze junction temperature of the chip using thermal resistance curves of the typical structure is presented,and solutions to associated problems are proposed. |
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| Keywords: | Hybrid IC Assembly structure Thermal design Thermal resistance |
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