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Crack-free micromachining on glass substrates by visible LIBWE using liquid metallic absorbers |
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| Authors: | Meng-Hua Yen Ching-Wen Huang Wen-Chi Hsu Klaus Zimmer |
| Affiliation: | a Institute of Biomedical Engineering, National Taiwan University, Taiwan b Research Center for Applied Sciences, Academia Sinica, Taipei, Taiwan c Department of Mechanical and Mechatronic Engineering, National Taiwan Ocean University, Taiwan d Institute of Biophotonics, National Yang-Ming University, Taiwan e Leibniz Institute of Surface Modification, Leipzig, Germany |
| Abstract: | Laser induced backside wet etching (LIBWE) is a promising laser direct-write technique for etching transparent materials and for producing high precision and near-optical quality surfaces. In this study, visible LIBWE using gallium and eutectic indium/gallium as absorbers was used for crack-free microfabrication of sodalime and quartz. Eutectic indium/gallium (In/Ga) has a melting temperature lower than metallic gallium does and the etching rate by using In/Ga was found to be similar to that by gallium for visible LIBWE. When using the gallium absorber, the etching threshold of quartz by visible LIBWE was about one-third of that by UV LIBWE. The heat-affected zone of the quartz etching was negligible at the trench rim in the visible LIBWE process. The wettability of the metallic absorbers on the substrates affects aspect ratio and is a new important factor for LIBWE. In addition, etching rate decreased when repetition rate was increased. |
| Keywords: | LIBWE Liquid assisted ablation Visible laser Glass machining Micromachining Eutectic In/Ga Gallium Metallic absorber Visible LIBWE |
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