Use of C-SAM acoustical microscopy in package evaluations and failure analysis

Acoustical microscopy is gaining wide acceptance in the microelectronic packaging community. C-mode scanning acoustical microscopy, C-SAM, is widely used in package evaluations and for failure analysis. This paper discusses several specific topics. These include: (1) popcorn cracking in SMDs; (2) an evaluation of solder die attach in power packages; (3) an instance of top of die delamination which resulted in electrical failures; and (4) moisture sensitivity of other surface mount power packages and how it resulted in ball bond degradation during a new product qualification.