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Influence of nitrogen partial pressure on morphology,structure and transport properties of reactive sputtered polycrystalline TiN films
Affiliation:1. Center for Sensory-Motor Interaction, Aalborg University, Fredrik Bajersvej 7E, 9220 Aalborg, Denmark;2. Neurodan A/S, Aalborg, Denmark;3. Bang & Olufsen Medicom A/S, Struer, Denmark;4. Aalborg University Hospital, Aalborg, Denmark;5. Danish Technological Institute, Århus, Denmark;1. Key Laboratory of Green Chemistry & Technology of the Ministry of Education, College of Chemistry, Sichuan University, Chengdu, 610064, PR China;2. College of Chemical Engineering, Sichuan University, Chengdu, 610065, PR China
Abstract:The surface morphology, structure and electrical transport properties of the polycrystalline TiN films fabricated using reactive sputtering at different N2 partial pressures (PN2) have been investigated systematically. The films grow with the preferred (200) orientation. The room-temperature resistivity first deceases, then slightly increases with the increase of PN2. The minimum room-temperature resistivity is about 1.7 × 10−3 Ω cm at PN2 = 0.5 Pa. The low temperature conductance mechanism turns from tunneling across the grain boundaries to variable-range hopping as PN2 increases. The decreased density of states at EF with the increase of N vacancies should be the reason for the increased resistivity of the films fabricated at different PN2.
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