Crosslinked copolymer with low dielectric constant and dissipation factor based on poly(2,6‐Dimethylphenol‐co−2,6‐Diphenylphenol) and a crosslinker |
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| Authors: | Min Chi Yang Tomoya Higashihara Hung Wen Su Mitsuru Ueda Wen‐Chang Chen |
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| Institution: | 1. Department of Chemical Engineering, National Taiwan University, Taipei, Taiwan;2. Department of Organic Materials Science, Graduate School of Organic Materials Science, Yamagata University, Yonezawa, Yamagata, Japan;3. Taiwan Taiyo Ink Co, Ltd., Taoyuan Country, Taoyuan, Taiwan |
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| Abstract: | The crosslinked poly(2,6‐dimethylphenol (95 mol %)‐co?2,6‐diphenylphenol (5 mol %)) (poly(2,6‐DMP95‐co?2,6‐DPP5)) was successfully developed as an insulating material separating conducting elements with a low dielectric constant and dissipation factor. The crosslinked poly(2,6‐DMP95‐co?2,6‐DPP5) was prepared by the oxidative coupling polymerization of 2,6‐DMP with 2,6‐DPP, followed by the reaction with 4,4′‐methylenebis2,6‐bis(methoxymethyl)]phenol (MBMP) as a crosslinking agent. The crosslinked poly(2,6‐DMP95‐co?2,6‐DPP5) exhibited a good thermal stability and glass transition temperature. The dielectric constant and dissipation factor of the crosslinked poly(2,6‐DMP95‐co?2,6‐DPP5) were 2.6 and 0.004 at 10 GHz, respectively. Moreover, a flexible double layer copper clad laminate based on the crosslinked poly(2,6‐DMP95‐co?2,6‐DPP5) composite was successfully prepared, indicating a useful material for high‐speed and high‐frequency electrical applications. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3218–3223 |
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| Keywords: | crossinked dielectric constant dissipation factor high performance polymer polycondensation polyethers poly(phenylene ether) |
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