| 陶瓷衬底的化学机械抛光技术研究 |
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| 引用本文： | 吕文利,魏唯,朱宗树,蒋超.陶瓷衬底的化学机械抛光技术研究[J].电子工业专用设备,2010,39(3):17-21. |
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| 作者姓名： | 吕文利 魏唯 朱宗树 蒋超 |
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| 作者单位： | 中国电子科技集团公司第四十八研究所,湖南长沙,410111 |
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| 摘 要： | 介绍了薄膜集成电路陶瓷衬底的化学机械抛光技术,概述了化学机械抛光原理和设备,讨论分析了影响陶瓷衬底的化学机械抛光的因素,并用实验加以验证。
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| 关 键 词： | 陶瓷 衬底 CMP 薄膜集成电路 |
Research of Chemical Mechanical Polishing Technique of Ceramic Substrate |
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| LV Wenli,WEI Wei,ZHU Zongshu,JIANG Chao.Research of Chemical Mechanical Polishing Technique of Ceramic Substrate[J].Equipment for Electronic Products Marufacturing,2010,39(3):17-21. |
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| Authors: | LV Wenli WEI Wei ZHU Zongshu JIANG Chao |
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| Institution: | (48th Institute of China Electronic Technology Group Corporation, Hunan Changsha 410111, China) |
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| Abstract: | Chemical mechanical polishing （CMP）technique of thin film integrated circuit Ceramic substrate was introduced in this paper. CMP theory and equipment were summarized. The factors that influence polishing rate and quality were Emphatically discussed. And the conclusion was proven by the experiment. |
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| Keywords: | CMP |
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