| 微通道板大量放气的原因 |
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| 引用本文： | 韦亚一,陶兆民.微通道板大量放气的原因[J].红外技术,1993(1). |
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| 作者姓名： | 韦亚一 陶兆民 |
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| 作者单位： | 中国科学院电子学研究所，中国科学院电子学研究所 北京 100081，北京 100081 |
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| 摘 要： | 本文分析了微通道板(MCP)在烘烤和电子轰击下大量放气的机理,结合有关实验数据给出了放气成分及放气量的相对大小。指出:放出的这些气体不仅对光阴极有毒害,而且对MCP自身的次级电子发射性能还有不良影响,即降低次级电子产额。在此基础上提出了解决MCP大量放气的方法。
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| 关 键 词： | 微通道板(MCP) 烘烤 电子轰击 放气 |
The Causes of Large Degassing of MCP |
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| Wei Yayi,Tao Zhaomin.The Causes of Large Degassing of MCP[J].Infrared Technology,1993(1). |
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| Authors: | Wei Yayi Tao Zhaomin |
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| Abstract: | The causes of large degassing of MCP under baking and electron bombarding were studied and the ingredients and relative quantity of degassing were given. According to experimental results, it is found that the degassing was harmful not only to photocathode but also to MCP itself. The methods of solving this problem were also suggested. |
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| Keywords: | MCP Baking Electron bombardment Degassing |
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