Siliconization for Wall Conditioning in the HL-2A Tokamak

Siliconization for Wall Conditioning in the HL-2A Tokamak

The sputtering of impurities is caused by the interactions between plasma and the first wall, and the recycling of the gas affects the particle and energy transport of plasmas with a complicated mechanism in plasma operation. It is important for present tokarnaks to achieve a good confinement and high performance plasmas by means of controls of the vacuum condition, usage of low Z materials, control of the recycling of neutral particles and suppressions of the appearances and yield of impurities. For higher plasma parameters, some of the first wall of HL-2A is covered with graphite materials and carbon fiber tiles. Hence the studies on the in-situ coating application and development, and the interactions between the coating film and plasma are needed to effectively control the impurity, improve plasma confinement and achieve high performance plasma.