Microstructure and properties of a copper electrocontact material with a nanodispersed titanium dioxide additive

The influence of TiO₂ nanopowder additive on the microstructure, physicomechanical properties, and performance characteristics of a copper-based composite is studied. The properties of the composites are compared with those of pure copper compacts. The microstructure and state of the composite’s working surface after performance tests are examined. It is shown that, when the amount of TiO₂ grows, the hardness of the material rises and the arc quenching effect is enhanced.