纳米级三氧化二铝对碱性钨抛光液的影响

研究了纳米级三氧化二铝颗粒的加入对以二氧化硅为磨料的碱性钨抛光液的影响。首先用单一因素法分析了三氧化二铝与二氧化硅质量比对原有碱性钨抛光液的去除速率的影响,以及氧化剂体积分数和pH值对抛光液去除速率的影响,取最优值,然后对添加三氧化二铝抛光液抛光后晶圆表面粗糙度进行了测试分析。实验结果显示在三氧化二铝与二氧化硅质量比为1∶2,二氧化硅水溶胶与去离子水体积比为1∶1,氧化剂体积分数为2%,pH值为9时,去除速率达到175 nm/min,较原有碱性钨抛光液提高约1倍,表面粗糙度为2.24 nm,能满足实际生产要求。

Influence of Nano-Alumina on Alkaline Tungsten Polishing Slurry

The effect of the addition of nanoscale alumina particles on the alkaline tungsten slurry with silica as an abrasive was studied.Firstly,using the single factor method,the effect of the mass ratio of alumina and silica on the removal rate of the original alkaline tungsten slurry was analyzed,and the effects of the oxidant volume fraction and pH value on slurry removal rate were also analyzed,and the optimal values were obtained.Then the wafer surface roughness was tested and analyzed after polishing by the slurry added alumina.The experimental results show that when the mass ratio of alumina and silica is 1∶2,the volume ratio of silica hydrosol and deionized water is 1∶1,the oxidant volume fraction is 2% and the pH value is 9,the removal rate is up to 175 nm/min,which is twice that of the original alkaline tungsten slurry,and the surface roughness is 2.24 nm,meeting the practical production requirements.