| 方块电阻法原位表征Cu薄膜氧化反应动力学规律 |
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| 引用本文： | 罗宇峰,钟澄,张莉,严学俭,李劲,蒋益明.方块电阻法原位表征Cu薄膜氧化反应动力学规律[J].物理学报,2007,56(11):6722-6726. |
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| 作者姓名： | 罗宇峰 钟澄 张莉 严学俭 李劲 蒋益明 |
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| 作者单位： | 复旦大学材料科学系,上海,200433 |
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| 基金项目： | 国家自然科学基金;科技部科研项目;上海市科委资助项目;上海市应用材料研究与发展项目;教育部985微纳电子科技创新平台项目 |
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| 摘 要： | 提出并建立了一种基于方块电阻测量的原位表征Cu薄膜氧化反应动力学规律的方法.利用Cu薄膜方块电阻随氧化时间的变化情况，得到氧化产物厚度与氧化时间的关系，反应动力学表征结果符合抛物线规律.还利用不同的氧化反应温度条件和对应的抛物线常数之间的关系得到体系的扩散激活能.结果表明，提出的表征方法适用于Cu薄膜氧化反应体系.
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| 关 键 词： | Cu薄膜 氧化反应 动力学 表征 |
| 文章编号： | 1000-3290/2007/56(11)/6722-05 |
| 收稿时间： | 3/7/2007 12:00:00 AM |
| 修稿时间： | 4/6/2007 12:00:00 AM |
An in situ method for characterizing the kinetics of the oxidation process of copper thin films via sheet resistance |
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| Luo Yu-Feng,Zhong Cheng,Zhang Li,Yan Xue-Jian,Li Jin,Jiang Yi-Ming.An in situ method for characterizing the kinetics of the oxidation process of copper thin films via sheet resistance[J].Acta Physica Sinica,2007,56(11):6722-6726. |
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| Authors: | Luo Yu-Feng Zhong Cheng Zhang Li Yan Xue-Jian Li Jin Jiang Yi-Ming |
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| Institution: | Department of Materials Science,Fudan University,Shanghai 200433,China |
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| Abstract: | In this paper, a new in situ method was developed for characterizing the kinetics of the oxidation process of copper thin films by using sheet resistance. Copper thin films were prepared on glass substrate by vacuum deposition. The oxidation kinetics of the copper thin films was studied via sheet resistance which increased during the process. The results suggested that this new method can be applied to the characterization of the reaction kinetics of copper thin film. |
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| Keywords: | copper thin film oxidation reaction kinetics characterization |
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