| 印制电子用阻焊油墨及其发展趋势 |
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| 引用本文： | 杨超,常煜,杨振国.印制电子用阻焊油墨及其发展趋势[J].影像科学与光化学,2014,32(4):314-320. |
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| 作者姓名： | 杨超 常煜 杨振国 |
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| 作者单位： | 复旦大学 材料科学系, 上海 200433 |
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| 摘 要： | 本文介绍了PCB制造过程中所用阻焊油墨的研究现状及其发展趋势，重点介绍了可喷墨打印阻焊油墨、柔性电路板用阻焊油墨、水溶性碱显影感光阻焊油墨和LED封装用白色阻焊油墨的研究现状及趋势。
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| 关 键 词： | 阻焊油墨 超支化树脂 喷墨打印 感光显影 |
| 收稿时间： | 2014-03-30 |
Solder Resist Ink for Printed Electronics and Its Developmental Tendency |
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| YANG Chao;CHANG Yu;YANG Zhenguo.Solder Resist Ink for Printed Electronics and Its Developmental Tendency[J].Imaging Science and Photochemistry,2014,32(4):314-320. |
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| Authors: | YANG Chao;CHANG Yu;YANG Zhenguo |
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| Institution: | Department of Material Science, Fudan University, Shanghai 200433, P.R. China |
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| Abstract: | Recent studies on solder resist ink for PCB manufacture and its developmental trendwere introducedand reviewed, focusing on solder resist ink for inkjet printing, solder resist for flexible electronics, water soluble photoimageable solder resist ink and white solder resist for LED package. |
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| Keywords: | solder resist ink hyperbranched resin inkjet printing photoimageable |
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