Ethylene adsorption on regularly stepped copper surface: C2H4 on Cu(210) |
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| Authors: | Daichi Yamazaki Michio Okada Francisco C. Franco Toshio Kasai |
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| Affiliation: | 1. Renovation Center of Instruments for Science Education and Technology, Osaka University, 8–1 Mihogaoka, Ibaraki, Osaka 567–0047, Japan;2. Department of Chemistry, Graduate School of Science, Osaka University, 1–1 Mchikaneyama-cho, Toyonaka, Osaka 560–0043, Japan;3. Institute of Scientific and Industrial Research, Osaka University, 8–1, Mihogaoka. Ibaraki, Osaka 567–0047, Japan |
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| Abstract: | Ethylene adsorption on regularly stepped Cu(210) surface was investigated with infrared reflection–adsorption spectroscopy and temperature programmed desorption. At 90 K, π-bonded ethylene was adsorbed on Cu(210) molecularly and all species were desorbed below 160 K. There were three types of π-bonded ethylene on the surface. Recent experimental studies have suggested that ethylene is dehydrogenated on Cu(410) due to the regular step [Kravchuk et al., J. Phys. Chem. C, 113 (2009) 20881]. However, neither the formation of di-σ-bonded ethylene nor dehydrogenation occurred on Cu(210). |
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