铅基压电薄膜材料的制备、微结构与性能

随着微电子技术的发展和高度集成化的趋势，压电薄膜材料愈来愈受到人们的重视.本文对铅基类压电薄膜材料的研究进展进行了评述，主要讨论了:(1) 两种主要制备方法:脉冲激光熔融法(PLD)和溶胶凝胶法(Sol-Gel); (2) 压电薄膜微观结构的表征，如畴结构，薄膜材料与大块材料的差别等；(3) 压电薄膜材料力学、电学及相互耦合性能的评价参数，薄膜处理过程的相变和残余应力和破坏特征.最后提出了人们可能关注的一些问题. 

PREPARATION, MICRO-STRUCTURE AND PROPERTIES OF LEAD-BASED PIEZOELECTRIC THIN FILMS

Piezoelectric thin films have recently received considerable attention for their attractive physical properties, including high dielectric, pyroelectric, piezoelectric and electrooptic properties. The excellent properties of the thin films promise potential applications in the fields of high integration. The advances of lead-based piezoelectric thin films are reviewed in the present paper. The review focuses on the following three fields: the preparation method, the micro-characterization and their properties. Two methods of preparation for the piezoelectric thin films are discussed: the pulsed laser deposition (PLD) and the solution-gelation (Sol-Gel). With respect to their characterization, the discussions are mainly on the domain structure, the different characterizations of the piezoelectric thin films and the relevant bulk materials. The properties are the parameters which describe the mechanical, electrical, electromechanical couple properties, phase traction as well as residual stress in piezoelectric thin film processing. The failure characterizations are also discussed in the field. In the end of the paper, we propose some fields which may be studied in the future.