| 高密度封装技术推动测试技术发展 |
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| 引用本文： | 鲜飞. 高密度封装技术推动测试技术发展[J]. 电子质量, 2006, 0(2): 9-11 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,武汉,430074 |
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| 摘 要： | 本文主要介绍了几种新型测试技术的特点,并对未来测试技术的发展趋势及方向进行了初步分析.
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| 关 键 词： | 集成电路 封装 测试技术 自动光学检测技术 自动X-射线检测 |
| 文章编号： | 1003-0107（2006）02-0009-02 |
High Density Packaging Technology Promoted the Development of Testing Technology |
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| Xian Fei. High Density Packaging Technology Promoted the Development of Testing Technology[J]. Electronics Quality, 2006, 0(2): 9-11 |
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| Authors: | Xian Fei |
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| Affiliation: | Fiberhome Telecommunication Technologies Co.,Ltd, Wuhan 430074,China |
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| Abstract: | Characteristics of several advanced testing technology are Introduced In the paper. The up-to-date trends are discussed and the future research directions are suggested. |
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| Keywords: | IC Package Testing Technology AOI AXI |
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