| 再流焊接设备性能评估方法 |
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| 引用本文： | 宋顺美.再流焊接设备性能评估方法[J].电子工业专用设备,2014(5):41-46. |
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| 作者姓名： | 宋顺美 |
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| 作者单位： | 日东电子科技深圳有限公司,广东深圳518103 |
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| 摘 要： | 再流焊接工艺是电子组装三大工序之一,其工艺的精确性直接决定了产品焊接质量。但由于再流焊接工艺的不可视化,使其成为工艺控制的难点。参考IPC-9853标准可对再流焊设备及工艺进行科学的量化评估,使其透明可视化,有助于工艺优化及控制。
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| 关 键 词： | 再流焊 工艺性能评估 短期制程能力(指数) 长期制程能力(指数) |
The Process Performance Assessment for Reflow Soldering Equipment |
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| SONG Shunmei.The Process Performance Assessment for Reflow Soldering Equipment[J].Equipment for Electronic Products Marufacturing,2014(5):41-46. |
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| Authors: | SONG Shunmei |
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| Institution: | SONG Shunmei (Suneast Electronics Electronics Science and Technology Co., Ltd., Shenzhen 518103, China) |
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| Abstract: | Reflow soldering process is one of the three major processes of electronic assembly, and precision process directly determines the product quality of soldering. But because of the reflow soldering process is not visible, that make it become difficult process control. We can carry out data to assess the reflow soldering equipment and technology referring to IPC-9853 standard, and make it transparent visualization, this would help to process optimization and control. |
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| Keywords: | Reflow Soldering Process performance evaluation Cp/Cpk Capability of Process（index） Pp/Ppk Performance of Process（index） |
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