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A Novel Analytical Approach for Multi-Layer Diaphragm-Based Optical Microelectromechanical-System Pressure Sensors
引用本文:李明 王鸣 戎华 李洪谱. A Novel Analytical Approach for Multi-Layer Diaphragm-Based Optical Microelectromechanical-System Pressure Sensors[J]. 中国物理快报, 2006, 23(5): 1211-1214
作者姓名:李明 王鸣 戎华 李洪谱
作者单位:[1]Key Laboratory of Opto-Electronic Technology, School of Physical Science and Technology, Naniing Normal University, Nanjing 210097 [2]Department of Electrical and Electronics Engineering, Shizuoka University, Hamamatsu, 432-8501, Japan
基金项目:Supported by the National Natural Science Foundation of China under Grant No 50375074, and the Jiangsu Provincial High- Novel Technology Project under Grant No BG2003024.
摘    要:An optical microelectromechanical-system (MEMS) pressure sensor based on multi-layer circular diaphragm is described and analysed by using the proposed novel analytical approach and the traditional transfer matrix method. The analytical expressions of the deflection of multi-layer diaphragm and absolute optical reflectance are derived respectively. The influence of residual stress on the deflection of diaphragm is also analysed. Simulation results given by the finite element method are consistent with the ones which are analysed by using the analytical approach. The analytical approach will be helpful to design and fabricate the optical MEMS pressure sensors with multi-layer diaphragm based on Fabry-Perot interferometry.

关 键 词:多层膜板 光微电机制系统压力传感器 MEMS 解析引道
收稿时间:2006-01-20
修稿时间:2006-01-20

A Novel Analytical Approach for Multi-Layer Diaphragm-Based Optical Microelectromechanical-System Pressure Sensors
LI Ming, WANG Ming, RONG Hua, LI Hong-Pu. A Novel Analytical Approach for Multi-Layer Diaphragm-Based Optical Microelectromechanical-System Pressure Sensors[J]. Chinese Physics Letters, 2006, 23(5): 1211-1214
Authors:LI Ming   WANG Ming   RONG Hua   LI Hong-Pu
Affiliation:1 Key Laboratory of Opto-Electronic Technology, School of Physical Science and Technology, Nanjing Normal University, Nanjing 210097; 2. Department of Electrical and Eiec-tronics Engineering, Shizuoka University, Hamamatsu, 432-8501, Japan
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