Effect of Silane Flow Rate on Structure and Corrosion Resistance of Ti-Si-N Thin Films Deposited by a Hybrid Cathodic Arc and Chemical Vapour Process

Ti--Si--N thin films with different silicon contents are deposited by a cathodic arc technique in an Ar+N₂+SiH₄ mixture atmosphere. With the increase of silane flow rate, the content of silicon in the Ti--Si--N films varies from 2.0at.% to 12.2at.%. Meanwhile, the cross-sectional morphology of these films changes from an apparent columnar microstructure to a dense fine-grained structure. The x-ray diffractometer (XRD) and x-ray photoelectron spectroscopy (XPS) results show that the Ti--Si--N film consists of TiN crystallites and SiN_x amorphous phase. The corrosion resistance is improved with the increase of silane flow rate. Growth defects in the films produced play a key role in the corrosion process, especially for the local corrosion. The porosity of the films decreases from 0.13% to 0.00032% by introducing silane at the flow rate of 14sccm.