Photoelastic modeling of stresses caused by thermal shock

The paper describes and evaluates an easy experimental method for subjecting the edges of photoelastic plate models to severe and repeatable thermal shock. It presents the development, with time, of the photoelasticfringe pattern at the edge of a plate and shows that this method simulates thermal-shock conditions in metallic materials of an intensity that is exceeded only under the most severe practical conditions. The resultant edge stresses are shown to increase to maximum values and then decrease with time as conditions shift from essentially plane strain to plane stress.