Wafer reuse for repeated growth of III–V solar cells

The epitaxial lift‐off (ELO) technique can be used to separate a III–V solar cell structure from its underlying GaAs or Ge substrate. ELO from 4‐inch Ge wafers is shown and 2‐inch GaAs wafer reuse after lift‐off is demonstrated without degradation in performance of the subsequent thin‐film GaAs solar cells that were retrieved from it. Since a basic wet chemical smoothing etch procedure appeared insufficient to remove all the surface contamination, wafer re‐preparation is done by a chemo‐mechanical polishing procedure. Copyright © 2010 John Wiley & Sons, Ltd.