温度对一维压电半导体梁弯曲特性的影响

采用微分算子法,理论研究了一维热压电半导体梁在横向力作用下的静态弯曲问题,得到了位移、电势、载流子、温度以及剪力、弯矩、电位移和电流密度等物理场的解析解,并分析了温度对n型ZnO压电半导体悬臂梁力电热耦合性能的调控作用.研究结果表明:温度能显著影响压电半导体梁的力电场分布,造成电势、载流子、电场和电位移在高温区域发生显著变化,而对于位移、剪力和弯矩影响较小.该温度调控效果主要是由热释电效应产生的极化电荷引起的.

Effect of Temperature on The Bending Characteristics of One-dimensional Piezoelectric Semiconductor Beams

In this paper, the static response of a thermal piezoelectric semiconductor (PSC) beam with flexural deformation is studied with a differential operator method. The analytical solutions of the deflection, electric potential, carrier density, temperature, shear force, bending moment, electric displacement and electric current density are obtained. The effects of temperature on the electromechanical behaviors of n-type ZnO piezoelectric semiconductor cantilever beam are discussed. The numerical results show that the temperature can significantly affect the electromechanical properties of PSC beams. It causes sudden changes of the electric potential, carrier density, electric field, and electric displacement in high temperature regions, while smaller changes of the deflection, shear force and bending moment. These effects are mainly induced by the polarization charges of pyroelectric effect.