Sub-wavelength micromachining of silica glass by irradiation of CO2 laser with Fresnel diffraction |
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| Authors: | K. Okazaki S. Torii T. Makimura H. Niino K. Murakami D. Nakamura A. Takahashi T. Okada |
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| Affiliation: | (1) Department of Electrical and Computer Engineering, Louisiana State University, Baton Rouge, LA 70803, USA;(2) Center for Advanced Microstructures and Devices, Louisiana State University, Baton Rouge, LA 70806, USA |
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| Abstract: | We investigated a simple and productive micromachining method of silica glass by ablation using a TEA CO2 laser (10.6 μm) with a spatial resolution down to sub-wavelength scale. The silica glass was irradiated by the TEA CO2 laser light through a copper grid mask with square apertures of 20×20 μm2 attached to the silica glass surface. After the irradiation, circular holes with a diameter of several μm were formed on the silica glass surface at the centers of the apertures due to the Fresnel diffraction effect. The minimum diameter of the holes was 3.4 μm. The characteristics of the micromachining are discussed based on the electric field distributions of the CO2 laser light under the mask using a three-dimensional full-wave electromagnetic field simulation. |
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