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Transient thermal elastic fracture of a piezoelectric cylinder specimen
Authors:D. M. Chang  B. L. Wang
Affiliation:1. Graduate School at Shenzhen, Harbin Institute of Technology, Harbin, 150001, People’s Republic of China
Abstract:A finite piezoelectric cylinder with an embedded penny-shaped crack is investigated for a thermal shock load on the outer surface of the cylinder. The theory of linear electro-elasticity is applied to solve the transient temperature field and the associated thermal stresses and electrical displacements without crack. These thermal stresses and electrical displacements are added to the surfaces of the crack to form an electromechanical coupling and mixed mode boundary-value problem. The electrically permeable crack face boundary condition assumption is used, and the thermal stress intensity factor and electrical displacement intensity factor at the crack border are evaluated. The thermal shock resistance of the piezoelectric cylinder is evaluated for the analysis of piezoelectric material failure in practical engineering applications.
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