Modeling and Analyses of Vias in Multilayered Boards with the Aid of Look-Up Tables |
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Authors: | Yue-Ming Zheng Bing-Zhong Wang and Yaowu Liu |
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Institution: | (1) Institute of Applied Physics, University of Electronic Science and Technology of China, Chengdu, 610054, People's Republic of China;(2) Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowlong, Hong Kong |
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Abstract: | Vias passing through multilayered boards are studied by using microwave network theory and antenna theory. By means of suitable electromagnetic simulations, the propagation parameters of vias are computed accurately. The results are then organized into a form of a look-up table so that some interpolation algorithm could be used. Compared with the direct numerical simulation, this kind of process could save much time and space resource, and its results are fairly good as shown in this paper. It has already been used in a CAD software. |
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