| 硅的切削液的分析研究 |
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| 引用本文： | 刘玉岭,檀柏梅,郝国强,郝美功.硅的切削液的分析研究[J].电子器件,2001,24(2):113-119. |
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| 作者姓名： | 刘玉岭 檀柏梅 郝国强 郝美功 |
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| 作者单位： | 河北工业大学, |
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| 摘 要： | 重点研究了硅的切削液的作用机理及相应切削液成分选择的理论依据，着重突出了对其渗透性和去除金属离子方面的研究。并在理论的指导下，研制出的切削液性能稳定，效果显著，实现了技术突破。
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| 关 键 词： | 切削液 表面张力 渗透性 螯合剂 硅 半导体材料 |
| 文章编号： | 1005-9490(2001)02-0113-07 |
| 修稿时间： | 2000年12月19 |
Analysis and Study of Theory of Silicon Cutting Fluid |
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| LIU Yuling,TAN Baimei,HAO Guoqiang,HAO Meigong.Analysis and Study of Theory of Silicon Cutting Fluid[J].Journal of Electron Devices,2001,24(2):113-119. |
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| Authors: | LIU Yuling TAN Baimei HAO Guoqiang HAO Meigong |
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| Abstract: | The theory of silicon cutting fluid and the basis of the theory of selecting components of cutting silicon fluid are analyzed, essentially permeability and getting rid of metal ions are studied. With these theories, cutting silicon fluid of stable property and remarkable effect is completed. Technical innovation is achieved. |
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| Keywords: | cutting fluid capillary permeability chelating agent |
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